Honeng Electronics Co., Ltd

Quality management

Quality management>Detection Methods

Hongeng electronic with long-term experience, are coping tactics for every kind of package, and can provide the best chip cover (Decap), adhesive (removal of sealing glue, Compound Removal), let your follow-up experiment benefited in every way. The following is a part of the project. Please contact us in detail.


Encapsulation open cover (Decap)

LED, gallium arsenide chip, car chip, optical coupling chip


Special open cover (Decap)

Backside, MEMS, packaging materials, various package dismantling


Chemical etching analysis

The crater, welded oil stains, chemical etching / to resist, Pin foot cleaning


As the type of packaging is quite diverse, it is advisable to have the experience of handling execution in various packaging forms.


    ic decap-開蓋

LED

    ic decap-去膠

Automotive chip

砷化鎵decap-開蓋

Gallium arsenide

IC decap-開蓋

Optocoupler  chip