Hongeng electronic with long-term experience, are coping tactics for every kind of package, and can provide the best chip cover (Decap), adhesive (removal of sealing glue, Compound Removal), let your follow-up experiment benefited in every way. The following is a part of the project. Please contact us in detail.
LED, gallium arsenide chip, car chip, optical coupling chip
Backside, MEMS, packaging materials, various package dismantling
The crater, welded oil stains, chemical etching / to resist, Pin foot cleaning
As the type of packaging is quite diverse, it is advisable to have the experience of handling execution in various packaging forms.