SAMTEC

Samtec 是电路板级互连领域的世界级制造商。Samtec 是一家跨国制造商,提供十分广泛的电子互连解决方案,包括微间距板对板系统(间距为 0.100"、2 mm、0.050"、1 mm、0.8 mm、0.635 mm、0.5 mm 和 0.4 mm)、 高速夹层系统、高密度阵列、IC 对板、防过时有源光纤、坚固型电源系统和电缆组件(IDC、分立线、密封/圆形和高速度)。为了


Samtec 是电路板级互连领域的世界级制造商。Samtec 是一家跨国制造商,提供十分广泛的电子互连解决方案,包括微间距板对板系统(间距为 0.100"、2 mm、0.050"、1 mm、0.8 mm、0.635 mm、0.5 mm 和 0.4 mm)、 高速夹层系统、高密度阵列、IC 对板、防过时有源光纤、坚固型电源系统和电缆组件(IDC、分立线、密封/圆形和高速度)。

为了迎接未来的互连挑战,Samtec 建立了专门的“技术中心”,专注于开发和推进各种性能和成本优势兼具的技术、产品,以确保从裸芯片到 100 米以外的接口以及这两者之间所有互连点的全面系统优化。



Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.