3M

3M 为电子行业提供创新解决方案,是板对板、线对板、背板和输入/输出 (I/O) 应用互连解决方案的顶级制造商。这些解决方案包括 3M™ 线装免剥接触式 (IDC) 连接器、小型三角带 (MDR) I/O 系统、Mini-Clamp 分立布线系统、MetPak™ 高速紧密矩阵式 (HSHM) 和新型超级紧密矩阵式 (UHM) 背板连接器。3M 的资深工程师利用业内领先的 CAD 建模能力,例如

 3M 为电子行业提供创新解决方案,是板对板、线对板、背板和输入/输出 (I/O) 应用互连解决方案的顶级制造商。这些解决方案包括 3M™ 线装免剥接触式 (IDC) 连接器、小型三角带 (MDR) I/O 系统、Mini-Clamp 分立布线系统、MetPak™ 高速紧密矩阵式 (HSHM) 和新型超级紧密矩阵式 (UHM) 背板连接器。3M 的资深工程师利用业内领先的 CAD 建模能力,例如 NX™ 和 SLA 建模,将创意转化为实际的解决方案。

3M 为印刷电路板制造、板装配和测试提供解决方案,例如粘合剂和胶带、嵌入式电容器材料、Textool™ 测试座和老化座、载板、盖带和托盘、柔性电路以及用于减少静电放电的产品。3M 还提供用于屏蔽 EMI/RFI、热管理和减震以及用于封装和标签的解决方案。


3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.